SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

• Main Authors: IWAMOTO HIROYUKI, TSURUTA KAICHI, TADOKORO YOSHIHIRO, IKEDA ATSUSHI, MUNEKATA OSAMU, MORIUCHI HIROYUKI, KAYAMA SHINICHI
• Format: Patent
• Language: English; Korean
• Published: 18.06.2018
• Subjects: ALLOYS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

본 발명은 외부응력형 위스커의 발생을 억제할 수 있는 도금용 땜납 합금 및 전자부품을 제공하는 것을 과제로 한다. 본 발명의 도금용 땜납 합금은 Sn과 Ni를 함유하고, Ni의 함유량이 0.06질량%이상 5.0질량%이하이며, 잔부가 Sn으로 이루어지고, 기계적 접합에 의해 도통하는 전기적 접점에 사용하는 도금용 땜납 합금이다. The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass% inclusive and the remainder comprising Sn, and is used in electrical contacts that are electrically connected through mechanical joining.