EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME

• Main Authors: CHUNG, JOO YOUNG, KWON, KI HYEOK, CHEON, JIN MIN, KIM, MIN GYUM
• Format: Patent
• Language: English; Korean
• Published: 18.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to an epoxy resin composition for sealing semiconductor devices, comprising an epoxy resin containing a compound represented by the chemical formula 1, a curing agent, and an inorganic filler. The present invention further relates to a semiconductor device encapsulated by using the same. In the chemical formula 1, A represents an aromatic ring group; X is O or N atom; R is hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 30 carbon atoms, an allyl group, an epoxy group, a glycidyl group, or an acrylic group; m1 and m2 are each independently an integer of 1 to 5; and n is an integer of 0 to 20. 본 발명은 하기 화학식 1로 표시되는 화합물을 포함하는 에폭시 수지, 경화제 및 무기 충전제를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치에 관한 것이다. [화학식 1]상기 화학식 1에서, A는 방향족 고리기; X는 O 또는 N원자; R은 수소, 탄소수 1 내지 10의 알킬기, 탄소수 6 내지 30의 아릴기, 알릴기, 에폭시기, 글리시딜기 또는 아크릴기; m1 및 m2는 각각 독립적으로 1 내지 5인 정수; n은 0 내지 20인 정수이다.