Photo-curable and Thermo-curable resin composition dry film and circuit board using the same

• Main Authors: SHIM, JI HYE, LEE, HWA YOUNG, YUN, GEUM HEE, PARK, YONG JIN, OGI SATOSHI
• Format: Patent
• Language: English; Korean
• Published: 14.06.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a photocurable and thermosetting resin composition composed of: 0.5-3 parts by weight of a benzoin-based photopolymerization initiator; 0.5-3 parts by weight of a benzophenone-based light absorber; and 50-80 parts by weight of an inorganic filler with respect to the total weight of the resin composition. The composition has excellent mechanical properties and adhesion to metal. 본 발명은 수지 조성물의 전체 중량을 기준으로, 0.5 내지 3 중량부의 벤조인계 광중합 개시제; 0.5 내지 3 중량부의 벤조페논계 광흡수제; 및 50 내지 80 중량부의 무기 필러를 포함하는, 광경화성 및 열경화성 수지 조성물의 제공에 관한 것이다. 상기 조성물은 기계적 물성 및 금속과의 밀착력이 우수한 효과가 있다.