Photo-curable and Thermo-curable resin composition dry film and circuit board using the same
Provided is a photocurable and thermosetting resin composition composed of: 0.5-3 parts by weight of a benzoin-based photopolymerization initiator; 0.5-3 parts by weight of a benzophenone-based light absorber; and 50-80 parts by weight of an inorganic filler with respect to the total weight of the r...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
14.06.2018
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a photocurable and thermosetting resin composition composed of: 0.5-3 parts by weight of a benzoin-based photopolymerization initiator; 0.5-3 parts by weight of a benzophenone-based light absorber; and 50-80 parts by weight of an inorganic filler with respect to the total weight of the resin composition. The composition has excellent mechanical properties and adhesion to metal.
본 발명은 수지 조성물의 전체 중량을 기준으로, 0.5 내지 3 중량부의 벤조인계 광중합 개시제; 0.5 내지 3 중량부의 벤조페논계 광흡수제; 및 50 내지 80 중량부의 무기 필러를 포함하는, 광경화성 및 열경화성 수지 조성물의 제공에 관한 것이다. 상기 조성물은 기계적 물성 및 금속과의 밀착력이 우수한 효과가 있다. |
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Bibliography: | Application Number: KR20160164654 |