경화성 및 경화된 접착제 조성물

• Main Authors: CLAPPER JASON D, XIA JIANHUI, EVERAERTS ALBERT I, TING CHUN YI, ELLIS MARK F, BEHLING ROSS E, BENSON KARL E
• Format: Patent
• Language: Korean
• Published: 11.06.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

자외 또는 가시광 방사선을 사용하여 경화될 수 있는 경화성 접착제 조성물이 제공된다. 경화성 (메트)아크릴레이트 공중합체를 함유하는 이러한 경화성 접착제 조성물은 크리프 컴플라이언스가 25℃에서 5(10) Pa미만이고, 크리프 컴플라이언스가 70℃에서 1(10) Pa초과이고, 25℃에서 1 라디안/초의 주파수로 측정할 때 전단 저장 모듈러스가 40 킬로파스칼 초과이다. Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.