에폭시 수지 조성물

• Main Authors: IWAYA KAZUKI, IMAI KAZUNARI
• Format: Patent
• Language: Korean
• Published: 11.06.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

본 발명은 100℃ 정도, 혹은 그 이하의 저온에서 10분간 정도, 혹은 그 이하의 단시간에 열경화할 수 있고, 추가로 접착 강도나 포트 라이프가 우수한 에폭시 수지 조성물을 제공한다. 본 발명의 에폭시 수지 조성물은 (A) 에폭시 수지, (B) 티올계 경화제, (C) 유효 성분으로서 1,4-디아자비시클로[2.2.2]옥탄(1,4-diazabicyclo[2.2.2]octane(DABCO))을 포함하는 이소시아네이트 어덕트형 마이크로캡슐화 경화 촉진제를 포함하고, 상기 (A) 성분의 에폭시 수지에 있어서의 방향족계 에폭시 수지와 지방족계 에폭시 수지의 비율(질량비)이 10:0∼2:8이며, 상기 (A)∼(C) 성분의 합계 100질량부에 대해, 상기 (C) 성분 중의 DABCO의 양이 0.01∼2질량부인 것을 특징으로 한다. The present invention provides an epoxy resin composition which is able to be thermally cured at a low temperature around 100°C or less in a short time around 10 minutes or less, while having excellent bonding strength and excellent pot life. An epoxy resin composition according to the present invention is characterized by containing (A) an epoxy resin, (B) a thiol-based curing agent and (C) an isocyanate adduct-type microencapsulated curing accelerator that contains, as an active ingredient, 1,4-diazabicyclo[2.2.2]octane (DABCO), and is also characterized in that: the ratio (mass ratio) of an aromatic epoxy resin to an aliphatic epoxy resin in the epoxy resin serving as the component (A) is from 10:0 to 2:8; and the amount of DABCO in the component (C) is 0.01-2 parts by mass relative to 100 parts by mass of the total of the components (A)-(C).