LAMINATE METHOD FOR CUTTING LAMINATE METHOD FOR PROCESSING LAMINATE AND DEVICE AND METHOD FOR CUTTING BRITTLE PLATE-LIKE OBJECT

• Main Authors: MIWA YOSHIHARU, HASEGAWA YOSHINORI, NODA TAKAYUKI, ETA MICHIHARU, MORI HIROKI
• Format: Patent
• Language: English; Korean
• Published: 30.05.2018
• Subjects: CHEMISTRY; GLASS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METALLURGY; MINERAL OR SLAG WOOL

적층판(2)의 양면에 유리판(4)을 각각 적층 일체화한 적층체(1)로서, 유리판(4)의 두께가 300㎛ 이하이고, 또한 유리판(4)의 끝면(4a)에 모따기 가공이 실시되어 있다. A processing method for a laminate comprisies: a cutting step of cutting the laminate obtained by integrally laminating a glass sheet on at least one of both surfaces of a resin sheet, wherein the thickness of the glass sheet alone is smaller than a thickness of the resin sheet; and a finishing step of finishing a cut surface of the laminate that is formed in the cutting step, the finishing step comprising: a first phase of processing a cut surface of the glass sheet by grinding, and leaving at least a part of a cut surface of the resin sheet in an unprocessed state; and a second phase of processing only the cut surface of the resin sheet that is left in the unprocessed state.