PHOTO CURABLE AND THERMO CURABLE RESIN COMPOSITION FOR HIGH RESOLUTION

• Main Authors: CHONG, SEOL AH, LEE, SU YEON, LEE, HWA YOUNG, YUN, GEUM HEE, PARK, YONG JIN, OGI SATOSHI
• Format: Patent
• Language: English; Korean
• Published: 14.05.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; GENERAL PROCESSES OF COMPOUNDING; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to a photo curable and thermos-curable resin composition having high resolution, which comprises: a photo-initiator (PI); a photo-absorber (PA); a thermo-curable thermosetting binder; and 60 to 80 parts by weight of an inorganic filler based on the total weight of the resin composition. According to the present invention, it is possible to provide the photo-curable and thermos-curable resin composition having high resolution, which is capable of forming fine vias and fine pitches by controlling the undercut and offset of the vias. 본 발명은 광개시제(PI); 광흡수제(PA); 열 경화가 가능한 열경화성 바인더; 및수지 조성물 전체 중량을 기준으로 60 내지 80중량부의 무기충전제를 포함하는, 고해상력 광경화성 및 열경화성 수지 조성물에 관한 것이다. 본 발명에 의하면, 비아의 언더컷 및 오프셋을 제어하여 미세 비아 및 미세 피치 형성이 가능한 고해상력 광경화성 및 열경화성 수지 조성물을 제공할 수 있다.