ELECTRODEPOSITED COPPER FOIL WITH ITS SURFACEPREPARED PROCESS FOR PRODUCING THE SAME AND USETHEREOF

The present invention relates to a surface treatment electrolysis copper foil produced by a foil manufacturing process and a surface treatment process. Wherein the surface treatment electrolysis copper foil comprises a base material and a surface protrusion unit formed on one surface of the base mat...

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Bibliographic Details
Main Authors JEON, HYOUNG JIN, KIM, YOUNG HYUN, JUN, SANG HYUN, PARK, JOON WOO
Format Patent
LanguageEnglish
Korean
Published 10.05.2018
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention relates to a surface treatment electrolysis copper foil produced by a foil manufacturing process and a surface treatment process. Wherein the surface treatment electrolysis copper foil comprises a base material and a surface protrusion unit formed on one surface of the base material. A ratio of thickness (Y=a/b) of a protrusion unit to thickness of the base material (b) and thickness of the surface protrusion unit (a) is equal to or larger than 0.15 and equal to or less than 0.69. 본 발명은 제박 공정과 표면처리 공정에 의해 제조되는 표면처리 전해동박에 관한 것으로서, 이 표면처리 전해동박은 기재와 이 기재의 일 표면상에 형성되는 표면돌기부로 이루어지고, 상기 기재의 두께(b)와, 상기 표면돌기부의 두께(a)에 대한 상대적 비율을 나타내는 돌기부 두께비(Y=a/b)가 0.15이상, 0.69이하인 것을 특징으로 한다.
Bibliography:Application Number: KR20160144734