LIQUID EPOXY RESIN COMPOSITION

• Main Authors: KUSHIHARA NAOYUKI, SUMITA KAZUAKI
• Format: Patent
• Language: English; Korean
• Published: 03.05.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides a liquid epoxy resin composition which is excellent in workability, adhesion to a substrate, and in which reliability of a resin is not impaired even under high temperature and high humidity. The liquid epoxy resin composition comprises (A) an epoxy resin (B) an imidazole-based curing accelerator, and (C) a maleimide compound, wherein the maleimide compound (C) has the weight average molecular weight (Mw) of 500 to 2,000, and the maleimide group equivalent per mole of the maleimide compound (C) is 250 to 1,000 g/eq. 작업성, 기재와의 밀착성이 우수하고, 고온 고습 하에서도 수지의 신뢰성이 손상될 일이 없는 액상 에폭시 수지 조성물의 제공. (A) 에폭시 수지 (B) 이미다졸계 경화 촉진제 및 (C) 말레이미드 화합물 을 포함하는 액상 에폭시 수지 조성물이며, 상기 (C) 말레이미드 화합물이 중량 평균 분자량(Mw) 500 내지 2,000이며, (C) 말레이미드 화합물 1몰당의 말레이미드기 당량이 250 내지 1,000g/eq인, 액상 에폭시 수지 조성물.