LIGHT EMITTING DEVICE PACKAGE

An embodiment of the present invention discloses a light emitting device package which includes: a light emitting element including a first electrode and a second electrode; a body including a cavity in which the light emitting element is arranged; first and second lead frames arranged inside the bo...

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Bibliographic Details
Main Authors SONG, JUNE O, KIM, WON JUNG, LIM, CHANG MAN
Format Patent
LanguageEnglish
Korean
Published 24.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An embodiment of the present invention discloses a light emitting device package which includes: a light emitting element including a first electrode and a second electrode; a body including a cavity in which the light emitting element is arranged; first and second lead frames arranged inside the body; and a first solder electrically connecting the first electrode to the first lead frame and a second solder electrically connecting the second electrode to the second lead frame. The body includes a first groove and a second groove arranged on a bottom surface thereof. The first solder is arranged in the first groove and the second solder is arranged in the second groove. Accordingly, the present invention can improve reliability by preventing the re-melting of the solder. 실시 예는, 제1전극 및 제2전극을 포함하는 발광소자; 상기 발광소자가 배치되는 캐비티를 포함하는 몸체; 상기 몸체 내부에 배치되는 제1, 제2리드프레임; 및 상기 제1전극과 제1리드프레임을 전기적으로 연결하는 제1솔더, 및 상기 제2전극과 제2리드프레임을 전기적으로 연결하는 제2솔더를 포함하고, 상기 몸체는 상기 바닥면에 배치되는 제1홈과 제2홈을 포함하고, 상기 제1솔더는 상기 제1홈에 배치되고, 상기 제2솔더는 상기 제2홈에 배치되는 발광소자 패키지를 개시한다.
Bibliography:Application Number: KR20160133710