Gas OLED OLED Luminescent Material Deposition Device Using Mixed Gas Cooled by Liquid Nitrogen

• Main Author: SO, MOON SOOK
• Format: Patent
• Language: English; Korean
• Published: 17.04.2018
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides an OLED luminescent material deposition device using mixed gas cooled by liquid nitrogen. Formation of an organic matter target, which is necessary to enable a luminescent organic matter for an OLED to be deposited, is performed as the organic matter target is heated in a vacuum state and is pressed for manufacturing. The mixed gas flows from a gas pipe to the upper part of the luminescent material organic matter in an in-line sputter device depositing the organic matter. The mixed gas lowers temperature in a deposit chamber by injecting gas in which at least one among the nitrogen, hydrogen, and fluoride is mixed to argon through the gas pipe including a liquid nitrogen tank, to the upper part of the target. So, the OLED luminescent material deposition device can prevent damage to the organic matter by suppressing a rise of the temperature generated on the target during the deposition. The deposition device used to deposit the organic matter enables the manufacture of the OLED element substrate in a sputtering method of preventing the damage to the organic matter due to the rise of the temperature and reducing the damage generated when colliding with a substrate as impact is reduced when an organic matter particle deposited by using RF power supply operated at low power and a cathode assembly for depositing the organic matter (a sputtering power source) with a high magnetic field are attached to the substrate. OLED용 발광 유기물을 증착 할 때 필요한 유기물 타켓 성형은 진공 챔버 안에서 진공상태에서 열을 가하고 압력을 주어서 제작이 가능하며 유기물을 증착하는 인라인 스퍼터 장치는 혼합가스가 가스관으로부터 발광소재 유기물의 상부로 흘려보내지며 혼합 가스는 알곤에 질소, 수소, 불소가스 중 적어도 하나 이상을 혼합한 가스로 액화질소탱크가 구비된 가스관을 통하여 타겟 상부에 주입하여 증착 챔버 내부의 온도를 낮추어 증착 중에 타켓 표면에 발생하는 온도가 상승하는 것을 억제하여 유기물의 손상을 방지하며, 유기물 증착에 사용되는 증착장치는 자기장이 높은 유기물 증착용 캐소드 어셈블리(Sputtering Power source)와 낮은 전력에서 가동되는 RF 파워 Supply를 활용하여 증착되는 유기물 입자가 기판에 부착될 때 충격이 완화되어 기판과 충돌시 발생하는 손상이 적어지고 온도상승으로 인한 유기물 손상을 방지하는 스퍼터링 방법으로 OLED소자 기판 제조가 가능하게 되었다.