METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The objective of the present invention is to provide a method for manufacturing a semiconductor device in which characteristics in a defect due to a crack occurring in a semiconductor device is reduced. By providing a crack suppression layer around a region where a semiconductor element is formed, a...

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Bibliographic Details
Main Author CHIDA AKIHIRO
Format Patent
LanguageEnglish
Korean
Published 09.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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