SHIELDING COATING FOR SELECTIVE METALLIZATION

• Main Authors: KWOK WAI YEE, KA MING YIP, CHIT YIU CHAN, HUNG TAT CHAN
• Format: Patent
• Language: English; Korean
• Published: 21.03.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; DIFFUSION TREATMENT OF METALLIC MATERIAL; GENERAL PROCESSES OF COMPOUNDING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A shielding coating is applied to a polymer substrate for selective metallization of the substrate. The shielding coating includes a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in an etched portion. A portion of the polymer substrate which contains the shielding coating inhibits the electroless metal plating. The primer contains polyamine, and the top coat contains a hydrophobic alky organic compound. 차폐 코팅은 기판의 선택적 금속화를 위해 폴리머 기판에 적용된다. 차폐 코팅은 프라이머 성분 및 소수성 탑 코트를 포함한다. 프라이머가 먼저 폴리머 기판에 적용되고 그 다음 탑 코트 성분의 적용이 따른다. 차폐 코팅은 그런 다음 목적 전류 패턴의 윤곽을 형성하기 위해 선택적으로 에칭된다. 촉매가 패턴화된 폴리머 기판에 적용되고 그 다음 에칭된 부분에 무전해 금속 도금이 따른다. 차폐 코팅을 함유하는 폴리머 기판의 부분은 무전해 금속 도금을 저해한다. 프라이머는 폴리아민을 함유하고 탑 코트는 소수성 알킬 유기 화합물을 함유한다.