에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료

• Main Authors: SANO KENTARO, TAKAIWA REO, KAWASAKI JUNKO, HIRANO NORIYUKI
• Format: Patent
• Language: Korean
• Published: 16.03.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

뛰어난 내열성 및 고온시의 기계 특성이 양호한 섬유 강화 복합 재료의 재료가 되는 에폭시 수지 조성물을 제공한다. 본 발명의 에폭시 수지 조성물은,［A1]이소시아누르산형 에폭시 수지, 및［A2]글리시딜아민형 에폭시 수지를 적어도 포함하는［A]에폭시 수지,［B]디시안디아미드, 및［C]디아미노디페닐설폰을 포함하고, (1)［A]에폭시 수지의 평균 에폭시 당량이 115~150 g/eq이고, (2) 성분［C]의 배합량이, 에폭시 수지 조성물 중의 전 에폭시 수지의 에폭시기에 대해, 활성수소기가 0.05~0.3당량으로 되는 양이다. Provided is an epoxy resin composition being a material for a fiber reinforced material having excellent heat resistance and excellent mechanical properties of material at high temperature. The epoxy resin composition of the present invention includes an [A] epoxy resin including at least an [A1] isocyanurate epoxy resin and a [A2] glycidyl amine epoxy resin, [B] dicyandiamide, [C] diaminodiphenyl sulfone, in which (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq; and (2) the amount of the component [C] added is in an amount of 0.05 equivalent to 0.3 equivalent relative to the epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.