PHOTOSENSITIVE RESIN COMPOSITION
A photosensitive resin composition contains a resin, a photopolymerizable compound, a photopolymerization initiator, a photopolymerization initiator containing a thioxanthone compound, and a solvent, wherein the photopolymerization initiator contains an α-amino ketone compound, a non-imidazole compo...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
05.03.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A photosensitive resin composition contains a resin, a photopolymerizable compound, a photopolymerization initiator, a photopolymerization initiator containing a thioxanthone compound, and a solvent, wherein the photopolymerization initiator contains an α-amino ketone compound, a non-imidazole compound and an oxime compound, and the content of the thioxanthone compound, based on 100 mass% of the α-amino ketone compound, is 80 mass% or more and 160 mass% or less.
수지, 광중합성 화합물, 광중합 개시제, 티오크산톤 화합물을 함유하는 광중합 개시제 및 용제를 함유하고, 광중합 개시제가 α-아미노케톤 화합물, 비이미다졸 화합물 및 옥심 화합물을 함유하는 광중합 개시제이고, 티오크산톤 화합물의 함유량이 α-아미노케톤 화합물의 함유량 100 질량부에 대하여, 80 질량부 이상 160 질량부 이하인 감광성 수지 조성물. |
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Bibliography: | Application Number: KR20180018165 |