PRINTED CIRCUIT BOARD

• Main Authors: KUHR WERNER G, WEI JEN CHIEH, LIU ZHIMING, SHI STEVEN Z
• Format: Patent
• Language: English; Korean
• Published: 21.02.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS BASED THEREON; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

본 발명의 구현예는 일반적으로 금속 표면의 처리하여 기판에의 접착 또는 결합을 향상시키기 위한 방법, 및 그에 의해 형성된 장치와 관련된다. 본 발명의 몇몇 구현예에서, 금속 표면의 토포그래피를 조면화하지 않고도 향상된 결합 강도를 얻는 방법이 제공된다. 이 방법에 의해 얻어진 상기 금속 표면은 수지층에 강한 결합을 제공한다. 상기 처리된 금속 및 상기 수지층 사이의 결합 계면은 적층 공정 이후 단계에 관여하는 열, 습기, 및 화학물질에 대해 저항을 나타내고, 따라서 PCB 생산에 적합하게 사용될 수 있다. 본 발명의 몇몇 구현예에 따른 방법은 특히 고밀도 다층 PCB의 제조, 특히 10 마이크론 이하의 선/간격을 갖는 회로를 가진 PCB 용으로 유용하다. 본 발명의 다른 구현예에 따른 방법은 특히 금속 표면을 코팅하는 광범위한 응용분야에서 특히 유용하다. Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.