SUBSTRATE FIXING DEVICE AND METHOD OF MANUFACTURING THEREOF

An objective of the present invention is to provide a substrate fixing device having improved heat resistance. The substrate fixing device of the present invention includes an electrostatic chuck for adsorbing and holding an object to be adsorbed and a base plate for mounting the electrostatic chuck...

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Bibliographic Details
Main Authors AOKI SHUZO, ASAHI YOJI, TAKEMOTO KEIICHI, HARAYAMA YOICHI
Format Patent
LanguageEnglish
Korean
Published 21.02.2018
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Summary:An objective of the present invention is to provide a substrate fixing device having improved heat resistance. The substrate fixing device of the present invention includes an electrostatic chuck for adsorbing and holding an object to be adsorbed and a base plate for mounting the electrostatic chuck, wherein the substrate fixing device includes: a base plate; a heat generation portion provided on the base plate; and an electrostatic chuck installed on the heat generation portion, wherein the heat generation portion includes a heat generation body having at least one roughened surface and an insulating layer covering the heat generation body, wherein the insulating layer and the electrostatic chuck are directly bonded. 본 발명은, 내열성을 향상시킨 기판 고정 장치를 제공하는 것을 과제로 한다. 본 발명의 기판 고정 장치는, 흡착 대상물을 흡착 유지하는 정전 척과 상기 정전 척을 탑재하는 베이스 플레이트를 구비한 기판 고정 장치로서, 베이스 플레이트와, 상기 베이스 플레이트 상에 설치된 발열부와, 상기 발열부 상에 설치된 정전 척을 포함하고, 상기 발열부는, 적어도 하나의 면이 조화(粗化)된 발열체와, 상기 발열체를 피복하는 절연층을 포함하며, 상기 절연층과 상기 정전 척이 직접 접합되어 있다.
Bibliography:Application Number: KR20170096709