3 In-Situ Sintering Method of Wiring of Three Dimension Electronic Circuit and Electronic Device Fabricated Using the Same

Provided is an in-situ sintering method of a wiring of a three-dimensional electronic circuit which can minimize damage to a three-dimensional structure and an electronic element without breaking a flow of a manufacturing process. The method comprises: forming a conductive wiring with a conductive i...

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Bibliographic Details
Main Authors SONG, DA SOM, BAE, IL JI, SHIN, JIN KOOG, HONG, YOUNG KYU
Format Patent
LanguageEnglish
Korean
Published 02.02.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is an in-situ sintering method of a wiring of a three-dimensional electronic circuit which can minimize damage to a three-dimensional structure and an electronic element without breaking a flow of a manufacturing process. The method comprises: forming a conductive wiring with a conductive ink on a surface of a three-dimensional structure; and selectively performing in-situ drying and sintering the conductive wiring by using a selective sintering energy source while forming the conductive wiring. 3차원 전자 회로의 배선의 인시츄 소결 방법이 제공된다. 이 방법은 3차원 구조체의 표면 상에 전도성 잉크로 전도성 배선을 형성하는 것 및 전도성 배선을 형성하는 것과 동시에 선택적 소결 에너지원을 이용하여 전도성 배선을 선택적으로 인시츄 건조 및 소결하는 것을 포함한다.
Bibliography:Application Number: KR20160094061