핫 멜트 접착제의 안정화

• Main Authors: MARTIN HEINRICH, FISCHER CLAUDIA, HOEVEL BERND, ROSER ANGELIKA
• Format: Patent
• Language: Korean
• Published: 31.01.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

본 발명은, a) 폴리올레핀, 예컨대 스티렌-이소프렌-스티렌 (SIS) 블록 공중합체, 스티렌-부타디엔-스티렌 (SBS) 블록 공중합체, 폴리아크릴레이트, 아크릴 공중합체, 에틸렌 비닐 아세테이트, 폴리아미드, 폴리에스테르, 폴리우레탄, 폴리이미드, 실란 종결된 폴리올레핀, 실란 종결된 폴리에테르 및 실란 종결된 폴리우레탄으로 이루어진 군으로부터 선택된 1종 이상의 핫 멜트 접착제(hot melt adhesive) 물질; 및 b) 성분 (A), (B) 및 (C) 중 2종 또는 3종을 포함하거나 또는 그로 이루어진 안정화제 조성물을 포함하는, 안정화된 핫 멜트 접착제이며, 여기서 (A)는 특정 입체 장애 아민 (HALS)이고, (B)는 중합체 입체 장애 아민 (HALS)이고, (C)는 특정 입체 장애 페놀인, 안정화된 핫 멜트 접착제에 관한 것이다. The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol.