INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM

Indium electroplating compositions electroplate substantially defect-free uniform layers which have a smooth surface on metal layers. The indium electroplating compositions can be used to electroplate indium metal on the metal layers of various substrates such as semiconductor wafers and as thermal...

Full description

Saved in:
Bibliographic Details
Main Authors YI QIN, MARK LEFEBVRE, KRISTEN FLAJSLIK
Format Patent
LanguageEnglish
Korean
Published 26.01.2018
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:Indium electroplating compositions electroplate substantially defect-free uniform layers which have a smooth surface on metal layers. The indium electroplating compositions can be used to electroplate indium metal on the metal layers of various substrates such as semiconductor wafers and as thermal interface materials. 인듐 전기도금 조성물은 금속 층 상에 평활면 형태학을 가지는 실질적으로 결함이 없는 균일한 층을 전기도금한다. 상기 인듐 전기도금 조성물은 반도체 웨이퍼와 같은 다양한 기판의 금속 층 상에 그리고 열 계면 물질로서 인듐 금속을 전기도금하기 위해 사용될 수 있다.
Bibliography:Application Number: KR20170084616