EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME

• Main Authors: CHUNG, JOO YOUNG, KWON, KI HYEOK, CHOI, JIN WOO, CHEON, JIN MIN, KIM, MIN GYUM
• Format: Patent
• Language: English; Korean
• Published: 17.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to an epoxy resin composition for encapsulating a semiconductor, and a semiconductor device encapsulated by using the epoxy resin composition. An objective of the present invention is to provide an epoxy resin composition which is capable of providing properties of low contraction and low elasticity while minimizing deterioration of physical properties such as fluidity, storage stability, adhesive force, moisture absorption rate and the like. The epoxy resin composition of the present invention comprises: an epoxy resin including a compound represented by chemical formula 1, a compound represented by chemical formula 2, or a mixture thereof; a curing agent; and an inorganic filler. In chemical formula 1, l is an integer of 1 to 3. In chemical formula 2, m and n are each independently an integer of 1 to 3. 본 발명은 하기 화학식 1로 표시되는 화합물, 하기 화학식 2로 표시되는 화합물 또는 이들의 혼합물을 포함하는 에폭시 수지; 경화제; 및 무기 충전제를 포함하는 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치에 관한 것이다. [화학식 1]상기 화학식 1에서, l은 1 내지 3인 정수임. [화학식 2]상기 화학식 2에서, m 및 n은 각각 독립적으로 1 내지 3인 정수임.