MOLD IMPRINTING METHOD IMPRINT APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ARTICLE

• Main Author: SHINODA KEN ICHIRO
• Format: Patent
• Language: English; Korean
• Published: 09.01.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

The present invention relates to a mold, an imprint method, an imprint device and a manufacturing method of an article. The mold used in the imprint device comprises: a pattern part in which a pattern is formed; and a surrounding part surrounding the pattern part. The surrounding part is provided with a light shielding part which shields cured light curing an imprint material and transmits detection light detecting a detection object. 임프린트 장치에 사용하는 몰드는, 패턴이 형성된 패턴부 및 패턴부를 둘러싸는 주변부를 포함하고, 주변부에는 임프린트재를 경화시키는 경화광을 차광하고 검출 대상을 검출하기 위한 검출광을 투과시키는 차광부가 제공된다.