Apparutus and Method of Detecting Thickness

• Main Authors: JUN, CHUNG SAM, YANG, YU SIN, SOHN, YOUNG HOON, RYU, SUNG YOON, JEE, YUN JUNG
• Format: Patent
• Language: English; Korean
• Published: 29.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; TESTING

According to an embodiment of the present invention, an apparatus of detecting a thickness comprises: a light source emitting a femtosecond laser; an optical coupler through which a portion of the femtosecond laser is incident onto a target and the other portion of the femtosecond laser is incident onto a reference mirror; a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal; and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other. 본 발명의 실시예에 따른 두께 측정 장치는, 펨토초 레이저를 방출하는 광원, 상기 방출된 펨토초 레이저의 일부를 타겟으로 입사시키고, 다른 일부를 기준 거울로 입사시키는 광 커플러, 상기 기준 거울에서 반사된 반사 신호 및 상기 타겟에서 발생된 샘플 신호가 입사되고, 상기 반사 신호와 상기 샘플 신호간의 간섭 신호로부터 상기 타겟의 두께를 측정하는 검출기 및 상기 광원, 상기 광 커플러, 그리고 상기 검출기를 연결하는 광 파이버를 포함한다.