COF PACKAGE AND DISPLAY DEVICE COMPRISING THE SAME

The present invention relates to a chip-on-film package capable of preventing deformation thereof, and a display apparatus including the same. The chip-on-film package according to an embodiment of the present invention comprises: a film; a driving integrated circuit chip placed on the film; an elec...

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Bibliographic Details
Main Authors SONG, SANG HYEON, KIM, BYOUNG YONG, HWANG, JEONG HO
Format Patent
LanguageEnglish
Korean
Published 21.12.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a chip-on-film package capable of preventing deformation thereof, and a display apparatus including the same. The chip-on-film package according to an embodiment of the present invention comprises: a film; a driving integrated circuit chip placed on the film; an electrode pad part placed on one side edge of the film; and a deformation prevention member placed between the driving integrated circuit chip and the electrode pad part. 본 개시는 칩 온 필름 패키지 및 이를 포함하는 표시 장치에 관한 것으로, 일 실시예에 의한 칩 온 필름 패키지는 필름, 상기 필름 위에 위치하는 구동 집적 회로 칩, 상기 필름의 일측 가장자리 위에 위치하는 전극 패드부, 및 상기 구동 집적 회로 칩 및 상기 전극 패드부 사이에 위치하는 변형 방지 부재를 포함한다.
Bibliography:Application Number: KR20160072653