Forming method of conductive fiber circuit

• Main Authors: OH, SEUNG SIK, LEE, HYUN KYUNG, LEE, JAE KYOUNG, KIM, EUN JOO, LIM, DAE YOUNG, YOO, EUI SANG
• Format: Patent
• Language: English; Korean
• Published: 27.11.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, ORYARNS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES; INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTIOND, RELATING TOTEXTILES; LOOMS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL FINISHING OF YARNS OR ROPES; METHODS OF WEAVING; PRINTED CIRCUITS; TEXTILES; WARPING OR BEAMING; WEAVING; WOVEN FABRICS; YARNS; YARNS OR THREADS

The present invention relates to a forming method of a conductive fiber circuit capable of applying various patterns and shapes. The forming method of a conductive fiber circuit comprises: a step (a) of embroidering on a water-soluble background cloth with a general fiber; a step (b) of locating a plurality of electric modules on the embroidered general fiber; a step (c) of embroidering gaps between the plurality of electric modules with a conducive fiber to connect the plurality of electric modules with the conductive fiber; and a step (d) of dissolving the background cloth in the water. 본 발명은 다양한 문양, 형상 등의 적용이 가능한 전도성 섬유회로 형성방법에 대한 발명으로, a) 수용성 바탕천 상에 일반사로 자수하는 단계; b) 상기 자수되어 있는 일반사 상에 복수의 전기모듈을 배치하는 단계; c) 상기 복수의 전기모듈 사이를 전도사로 자수하여, 상기 복수의 전기모듈을 전도사로 연결하는 단계; d) 상기 바탕천을 물에 용해시키는 단계를 포함하는 것을 특징으로 한다.