벤팅 장치

• Main Author: BACINO JOHN E
• Format: Patent
• Language: Korean
• Published: 23.10.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PRINTED CIRCUITS; SEPARATION; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

본원은 벤팅 장치(100)를 개시한다. 상기 벤팅 장치는 안쪽에 개구(104)를 갖는 기재(102), 예컨대 금속 기재 또는 스페셜티 플라스틱 기재와, 상기 개구 위로 배치되고 열가소성 재료(110)를 사용하여 상기 기재 위에 써멀 본딩된 플루오로폴리머 멤브레인(106), 예컨대 ePTFE를 포함한다. 이로써 상기 플루오로폴리머 멤브레인은 접착제층을 사용하지 않고도 상기 기재에 직접 본딩될 수 있다. A venting apparatus (100) is disclosed herein. The venting apparatus comprises a substrate (102), such as a metal substrate or a specialty plastic substrate, having an opening (104) therein and a fluoropolymer membrane (106) , such as ePTFE, disposed over said opening and thermally bonded using a thermoplastic material (110) to said substrate. This allows the fluoropolymer membrane to be directly bonded to the said substrate without using an adhesive layer.