PROCESS FOR PRODUCING PRINTED WIRING BOARD

• Main Authors: OHKOSHI MASANORI, NARAHASHI HIROHISA
• Format: Patent
• Language: English; Korean
• Published: 12.10.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

[과제] 지지체를 부착한 채로 수지 조성물층을 열경화하여 절연층을 형성하였다고 해도, 경화 얼룩 등이 없는 프린트 배선판의 제조 방법 등의 제공. [해결 수단] (A) 지지체, 당해 지지체 위에 형성된 수지 조성물층을 구비하는 접착 시트를 준비하는 공정, (B) 수지 조성물층이 내층 기판과 접합하도록, 내층 기판에 적층하는 공정, 및 (C) 접착 시트를 T1(℃)으로부터 T2(℃)로 가열함으로써 열경화시켜, 절연층을 형성하는 공정을 포함하고, T1(℃)으로부터 T2(℃)로의 가열 시의 MD 방향의 지지체의 최대 팽창률과, 가열 종료 시점에서의 지지체의 팽창률과의 차와, T1(℃)으로부터 T2(℃)로의 가열 시의 TD 방향의 지지체의 최대 팽창률과, 가열 종료 시점에서의 지지체의 팽창률과의 차의 합을 X, 120℃ 이상에서의 수지 조성물층의 최저 용융 점도를 Y로 했을 때, Y＞2700X의 관계를 충족시키도록 열경화시킨다. Printed wiring boards with reduced curing unevenness and the like may be produced by (A) preparing an adhesive sheet having a support and a resin composition layer provided on the support, (B) laminating the adhesive sheet on an internal layer substrate so that the resin composition layer is in contact with the internal layer substrate, and (C) thermally curing the adhesive sheet by heating from T1 (° C.) to T2 (° C.), to form an insulating layer, wherein the adhesive sheet is thermally cured so that a relation of Y>2700X is satisfied in which X is the sum of a difference between a maximum expansion rate of the support in the MD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and a difference between a maximum expansion rate of the support in the TD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate of the support at the end of heating and Y is the lowest melt viscosity of the resin composition layer at 120° C. or higher.