EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME

• Main Authors: HAN, SEUNG, KIM, MIN GYUM
• Format: Patent
• Language: English; Korean
• Published: 27.09.2017
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention relates to an epoxy resin composition for encapsulating a semiconductor device, comprising a phosphorus-based flame retardant represented by chemical formula 1; an epoxy resin; a curing agent; and an inorganic filler, and a semiconductor device encapsulated by using the same. In the chemical formula 1, R_a and R_b are respectively and independently hydrogen or an alkyl group having 1 to 4 carbon atoms, and n is 1-3. 본 발명은 하기 화학식 1로 표시되는 인계 난연제; 에폭시 수지; 경화제; 및 무기 충전재를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자에 관한 것이다. [화학식 1]상기 화학식 1에서, R및 R는 각각 독립적으로 수소 또는 탄소수 1 내지 4인 알킬기이며, n은 1 ~ 3임.