ELEMENT PACKAGE AND MANUFACTURING METHOD FOR THE SAME

The present disclosure relates to an element package which includes a substrate, an element disposed on the substrate, a cap for receiving the element, a junction for bonding the substrate and the cap, and a blocking part disposed on both sides of the junction, and a manufacturing method thereof. It...

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Main Authors KANG PIL JOONG, KANG, YUN SUNG, KIM, KWANG SU, SONG, JONG HYEONG, LEE, HYUN KEE, YANG, JEONG SUONG, LEE, JEONG IL, SHIN, SEUNG JOO
Format Patent
LanguageEnglish
Korean
Published 27.09.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to an element package which includes a substrate, an element disposed on the substrate, a cap for receiving the element, a junction for bonding the substrate and the cap, and a blocking part disposed on both sides of the junction, and a manufacturing method thereof. It is possible to sufficiently perform a bonding process even with a small amount of bonding material regardless of the thickness of the cap and the substrate. 본 개시는 기판, 상기 기판에 배치된 소자, 상기 소자를 수용하는 캡, 상기 기판과 상기 캡을 접합하는 접합부, 및 상기 접합부의 양 측에 배치된 차단부를 포함하는 소자 패키지 및 그 제조방법에 관한 것이다.
Bibliography:Application Number: KR20160032166