Populated printed circuit board and method for populating a printed circuit board

• Main Authors: RIZA OGUZ, MICHAEL STORZINGER, ANDREAS BAUMER, SISAY TADELE, HELMUT HOPPE, MARKUS WETZEL, ALEXANDER ALEXANDER DAUTH
• Format: Patent
• Language: English; Korean
• Published: 20.09.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a printed circuit board. The printed circuit board has at least one soldered power semiconductor and a spring (3) as a thermal fuse. The spring (3) has two contact arms fixed to the solder pads (4a) of a printed circuit board (1) by a solder connection part. Because the spring (3) is under mechanical stress, as soon as the solder connection part loses its rigidity due to overheating, at least one of the two contact arms is detached from one of the solder pads (4a) of the printed circuit board by a spring force. According to the invention, at least one of the solder connection parts of the contact arms loses its rigidity at low temperatures, and includes alloy different from the solder connection part connecting the power semiconductor to the printed circuit board (1). A method for mounting a printed circuit board is also described. An electrical circuit can be better protected by the thermal fuse. 본 발명은 납땜된 적어도 하나의 전력 반도체 및, 온도 퓨즈로서의 스프링(3)을 갖고, 상기 스프링(3)은 납땜 연결부에 의해 인쇄회로기판(1)의 땜납 패드(4a)에 고정되는 2개의 접촉 암을 가지며, 상기 스프링(3)이 기계적 응력하에 있어, 납땜 연결부가 과열로 인해 강성을 잃는 순간 상기 2개의 접촉 암 중 적어도 하나가 스프링 력에 의해 인쇄회로기판의 땜납 패드(4a) 중 하나로부터 떨어져 이동하게 되는 인쇄회로기판에 관한 것이다. 본 발명에 따르면, 상기 접촉 암들 중 적어도 하나의 납땜 연결부는 저온에서 강성을 잃고, 전력 반도체를 인쇄회로기판(1)에 연결하는 납땜 연결부와 상이한 합금을 포함한다. 인쇄회로기판을 실장하는 방법이 또한 설명된다.