플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판

• Main Authors: TAKEUCHI MASAKI, MATSUURA YOSHITSUGU, NAKANO YUTA, OBATA KAZUHITO, YASU KATSUHIKO
• Format: Patent
• Language: Korean
• Published: 25.08.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

본 발명은, 탄소수 10 이상의 알킬렌쇄를 포함하는 주쇄와, 알킬렌쇄에 결합된 알킬기를 포함하는 측쇄를 갖는 장쇄 알킬비스말레이미드 수지, 및 장쇄 알킬비스말레이미드 수지와 반응하는 관능기를 2 이상 갖는 경화제를 함유하는 수지 조성물을 포함하는, 플렉시블 프린트 배선판용 수지 필름에 관한 것이다. The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.