DEBONDING SCHEMES

A method includes accommodating a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debon...

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Bibliographic Details
Main Authors LIU PING YIN, CHAO LAN LIN, LIN HUNG HUA, TSAI CHIA SHIUNG, HUANG XIN HUA
Format Patent
LanguageEnglish
Korean
Published 24.08.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method includes accommodating a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debonded from the second wafer by using at least one blade. In another embodiment, a desorber having a convex lower surface is attached to the wafer stack. The first wafer is debonded from the second wafer by using the desorber. Therefore, the breakage of the wafers can be prevented. 방법은 함께 본딩된 적어도 2개의 웨이퍼들을 갖는 웨이퍼 스택을 수용하는 것을 포함한다. 적어도 하나의 블레이드가 적어도 2개의 웨이퍼들 중 제1 웨이퍼와 적어도 2개의 웨이퍼들 중 제2 웨이퍼 사이에 삽입된다. 블레이드는 공기 또는 유체를 주입하도록 구성된 채널을 갖는다. 제1 웨이퍼는 적어도 하나의 블레이드를 사용하여 제2 웨이퍼로부터 디본딩된다. 다른 실시예에서, 볼록 하부면을 갖는 탈착기는 웨이퍼 스택에 부착된다. 제1 웨이퍼는 탈착기를 사용하여 제2 웨이퍼로부터 디본딩된다.
Bibliography:Application Number: KR20170101492