OXAZINE RESIN COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: KAMEYAMA TOMOKAZU, HORITA YUKO, KAWASAKI SHINYA, ASAKAGE HIDEYASU
• Format: Patent
• Language: English; Korean
• Published: 22.08.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The purpose of the present invention is to provide an oxazine resin composition which is excellent in heat resistance and has good dimensional stability even at industrial curing conditions of low temperature and short time, and a cured product the oxazine resin composition. The oxazine resin composition comprises an oxazine resin (A) and an epoxy resin (B), wherein the oxazine resin (A) is represented by the following formula (1). In gel permeation chromatography (GPC) measurement, the oxazine resin composition has 15% or less of a content for the body of n = 0, 35 to 70% of a total content for bodies of n = 1 and n = 2, 50% or less of a content for the body of n = 3 or higher, and a molecular weight distribution with a number average molecular weight of 400 to 2500. In chemical formula 1, A_1 is an aromatic ring group selected from a benzene ring, a naphthalene ring, and a biphenyl ring; X is a divalent cross-linking group; m is 1 or 2; and n is 1 to 5. (과제) 공업적인 저온 단시간에서의 경화 조건이어도, 내열성이 우수하고, 치수 안정성이 양호한 경화물을 부여하는 옥사진 수지 조성물 및 그 경화물을 제공한다. (해결 수단) 옥사진 수지 (A) 와 에폭시 수지 (B) 를 함유하고, 옥사진 수지 (A) 가 하기 식 (1) 로 나타나고, GPC 측정에 있어서 n = 0 체의 함유율이 15 ％ 이하이고, n = 1 체와 n = 2 체의 함유율의 합계가 35 ∼ 70 ％ 이고, n = 3 체 이상의 함유율이 50 ％ 이하이고, 수평균 분자량이 400 ∼ 2500 인 분자량 분포를 갖는 옥사진 수지 조성물. [화학식 1](여기서, A은 벤젠 고리, 나프탈렌 고리 또는 비페닐 고리에서 선택되는 방향족 고리기이고, X 는 2 가의 가교기이고, m 은 1 또는 2 이고, n 은 1 ∼ 5 이다.)