Acoustic wave filter device package for manufacturing acoustic wave filter device

• Main Authors: KANG PIL JOONG, KANG, YUN SUNG, NAM, JI HYE, KIM, KWANG SU, YANG, JEONG SUONG, SONG, JONG HYEONG, LEE, JEONG IL
• Format: Patent
• Language: English; Korean
• Published: 14.08.2017
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

Disclosed is an acoustic wave filter device with excellent oxidation resistance and excellent mechanical properties of fracture toughness or the like. The acoustic wave filter device comprises: an acoustic wave filter unit; a base in which the acoustic wave filter unit is formed on one surface, and a bonding unit is formed around the acoustic wave filter unit; and a cap bonded to the base by forming a bonding corresponding unit corresponding to the bonding unit. The bonding unit has a first bonding layer composed of a gold material. The bonding corresponding unit is bonded to the first bonding layer, and has a second bonding layer composed of a tin material. 음향파 필터부와, 상기 음향파 필터부가 일면에 형성되며 상기 음향파 필터부의 주위에 접합부가 형성되는 베이스 및 상기 접합부에 대응되는 접합 대응부가 형성되어 상기 베이스에 접합되는 캡을 포함하며, 상기 접합부는 금 재질로 이루어지는 제1 접합층을 구비하며, 상기 접합 대응부는 상기 제1 접합층에 접합되며 주석 재질로 이루어지는 제2 접합층을 구비하는 음향파 필터 장치가 개시된다.