PHOTOSENSITIVE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE

• Main Authors: HORII MAKOTO, HASHIMOTO KAZUMI, SUGIYAMA HIROMICHI
• Format: Patent
• Language: English; Korean
• Published: 04.07.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

본 발명의 감광성 접착제 조성물은, (A) 알칼리 가용성 수지와, (B) 광산발생제와, (C) 에폭시 화합물과, (D) 융점이 50~150℃인 페놀 화합물을 포함하는 것을 특징으로 한다. 본 발명의 감광성 접착제 조성물의 경화물을, 반도체 소자끼리를 접착하는 접착층으로서 이용함으로써, 반도체 소자와 접착층의 계면에 기포(보이드)가 발생하는 것을 저감시킬 수 있으며, 또 계면에 기포가 발생해도 그 발생한 기포를 제거할 수 있다. 그 결과, 반도체 소자끼리의 접착성(밀착성)을 높일 수 있다. This photosensitive adhesive composition is characterized by containing (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound, and (D) a phenol compound having a melting point of 50-150 °C. By using a cured product of the photosensitive adhesive composition as an adhesive layer that adheres semiconductor elements to one another, it is possible to prevent bubbles (voids) from forming in an interface between the adhesive layer and a semiconductor element, and, even when bubbles form in the interface, to remove said bubbles. As a result, it is possible to enhance the adhesiveness (close adhesion) of semiconductor elements to one another.