COMPOUND FOR FORMING ORGANIC FIRM COMPOSITION FOR FORMING ORGANIC FIRM METHOD FOR FORMING ORGANIC FIRM AND PATTERNING PROCESS

• Main Authors: OGIHARA TSUTOMU, KIKUCHI RIE, WATANABE TAKERU, TANEDA YOSHINORI, KORI DAISUKE
• Format: Patent
• Language: English; Korean
• Published: 04.07.2017
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

[과제] 고도의 매립/평탄화 특성을 갖는 유기막 형성용 조성물을 부여하는 유기막 형성용 화합물을 제공한다. [해결 수단] 유기막 형성용의 화합물로서, 50℃ 이상 300℃ 이하의 범위에서 측정되는 복소 점성률의 최소치가 10 Pa·s 이하인 것임을 특징으로 하는 유기막 형성용 화합물. The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C. This compound for forming an organic film can provide an organic film composition having high filling and planarizing properties.