MOLD RELEASE FILM

• Main Author: YOON, WAN SHIK
• Format: Patent
• Language: English; Korean
• Published: 22.05.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

The present invention relates to a mold release film which includes: an adhesive layer containing an acrylic adhesive or a silicone based adhesive, and a conductive polymer; and an antistatic layer containing metal or a conductive polymer. The mold release film additionally includes at least one of a base material layer and a heat resistant layer. The mold release film according to the present invention has proper adhesive force which shows adhesion and detachability at the same time, has an excellent antistatic effect, and can prevent the contamination of a mold. 본 발명은, 아크릴계 점착제 또는 실리콘계 점착제와, 전도성 폴리머를 포함하는 점착층, 금속 또는 전도성 폴리머를 포함하는 대전 방지층을 포함하고, 기재층 및 내열성층 중 하나 이상을 포함하는 이형 필름에 관한 것이다. 이러한 본 발명에 따른 이형 필름은, 접착성과 박리성을 동시에 나타내는 적절한 점착력을 가지며, 대전방지 효과가 우수하고, 몰드 오염 등을 방지할 수 있다.