THERMOSETTING RESIN COMPOSITION AND PREPREG INSULATING FILM WITH SUPPORT LAMINATE PLATE AND PRINTED WIRING BOARD EACH OBTAINED USING SAME

• Main Authors: TSUCHIKAWA SHINJI, IRINO TETSUROU, IZUMI HIROYUKI, KOTAKE TOMOHIKO, TAKANEZAWA SHIN, MURAI HIKARI, MIYATAKE MASATO
• Format: Patent
• Language: English; Korean
• Published: 11.05.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

본 발명은, 1 분자 중에 적어도 2개의 N-치환 말레이미드기를 갖는 말레이미드 화합물 (a)와, 1 분자 중에 적어도 2개의 1급 아미노기를 갖는 아민 화합물 (b)를 유기 용매 중에서 반응시켜 제조되는 불포화 말레이미드기를 갖는 수지 조성물 (A), 열경화성 수지 (B) 및 이소시아네이트 마스크 이미다졸이나 에폭시 마스크 이미다졸 등의 변성 이미다졸 화합물 (C)를 함유하는 열경화성 수지 조성물, 및 이를 이용한 프리프레그, 지지체 부착 절연 필름, 적층판 및 인쇄 배선판에 관한 것이다. A thermosetting resin composition containing: (A) a resin composition having an unsaturated Maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.