PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Provided are a printed circuit board which can realize a circuit with high density, and a manufacturing method thereof. According to an embodiment of the present invention, the printed circuit board comprises: an insulating layer formed a first circuit; a via hole formed on the insulating layer to e...

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Bibliographic Details
Main Authors KO, YOUNG KUK, BAEK, YONG HO, MOK, JEE SOO, LEE, DONG KEUN, KIM, SANG HOON, LEE HYUNGKI
Format Patent
LanguageEnglish
Korean
Published 10.05.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Provided are a printed circuit board which can realize a circuit with high density, and a manufacturing method thereof. According to an embodiment of the present invention, the printed circuit board comprises: an insulating layer formed a first circuit; a via hole formed on the insulating layer to expose at least a part of the first circuit; and a via formed in the via hole. Upper and lower end units of the via are separated from the insulating layer on one side of the via. 본 발명의 실시예에 따른 인쇄회로기판은, 제1 회로 상에 형성된 절연층, 상기 제1 회로의 적어도 일부가 노출되도록 상기 절연층에 형성되는 비아홀 및 상기 비아홀 내에 형성되는 비아를 포함하고, 상기 비아의 일측면에서, 상기 비아의 상단부 및 하단부는 상기 절연층과 이격된다.
Bibliography:Application Number: KR20150149487