LOW DIELECTRIC ADHESIVE COMPOSITION

• Main Authors: MIKAMI TADAHIKO, SAKATA HIDEYUKI, ITO TAKESHI, KASHIHARA KENJI
• Format: Patent
• Language: English; Korean
• Published: 04.05.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

본 발명은 종래의 폴리이미드 및 폴리에스테르 필름뿐만 아니라, LCP 등의 저극성 수지 기재(基材)나 금속 기재와 높은 접착성을 갖고, 높은 땜납 내열성을 얻을 수 있으며, 또한 저유전 특성이 우수한 접착제 조성물을 제공한다. 그 접착제 조성물은 하기 (A) 성분 및 (B) 성분을 함유하고, 또한 (C) 성분 및 (D) 성분 중 적어도 한쪽을 함유한다: (A) 성분: 결정성 산 변성 폴리올레핀, (B) 성분: 비결정성 폴리올레핀, (C) 성분: 카르보디이미드 수지, 및 (D) 성분: 에폭시 수지. Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, can achieve high solder heat resistance and has excellent low dielectric characteristics. The adhesive composition comprises component (A) and component (B) together with component (C) and/or component (D): component (A): a crystalline acid-denatured polyolefin; component (B): an amorphous polyolefin; component (C): a carbodiimide resin; and component (D): an epoxy resin.