HOT MELT ADHESIVE COMPOSITION

• Main Authors: RICKEY CYNTHIA, JIN YI, MCLENNAGHAN ALLAN W, YALVAC SELIM, IVERSON CARL, WALTON KIM, MARCHAND GARY, BROWN KATE
• Format: Patent
• Language: English; Korean
• Published: 21.04.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

본 개시내용은 조성물을 제공한다. 일 구현예에서, 접착제 조성물이 제공되고, 이는 하기를 포함한다: (A) (i) 1.0 미만의 쾨니히 B-값(Koenig B-value); (ii) 0.01% 내지 0.03%의 프로필렌 몰당 총 불포화도; (iii) 0.870 g/cc 내지 0.890 g/cc의 밀도; (iv) 800 mPa.s 내지 11,000 mPa.s의 177℃에서의 용융 점도; 및 (v) 20,000 내지 50,000 g/mol의 중량 평균 분자량을 갖는 에틸렌으로부터 유도된 최대 10 중량% 단위를 포함하는 프로필렌계 플라스토머 또는 엘라스토머 (PBPE); B) 점착부여제; 및 C) 왁스. The present disclosure provides a composition. In an embodiment an adhesive composition is provided and includes A) a propylene based plastomer or elastomer (PBPE) comprising up to 10 wt % units derived from ethylene and having (i) a Koenig B-value less than 1.0; (ii) a total unsaturation per mole of propylene from 0.01% to 0.03%; (iii) a density from 0.870 g/cc to 0.890 g/cc; (iv) a melt viscosity at 177° C. from 800 mPa·s to 11,000 mPa·s; and (v) a weight average molecular weight from 20,000 to 50,000 g/mol; B) a tackifier; and C) a wax.