METHOD FOR MANUFACTURING HETEROJUCTION PRINTED CIRCUIT BOARD

The present invention relates to a method for manufacturing a heterojunction printed circuit board. The method for manufacturing a heterojunction printed circuit board comprises: a step of forming a hard substrate; a step of forming a circuit pattern on a flexible substrate to form a flexible circui...

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Bibliographic Details
Main Authors YUN, HUI IL, LEE, CHANG JOON
Format Patent
LanguageEnglish
Korean
Published 24.03.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a method for manufacturing a heterojunction printed circuit board. The method for manufacturing a heterojunction printed circuit board comprises: a step of forming a hard substrate; a step of forming a circuit pattern on a flexible substrate to form a flexible circuit board; a step of bonding the hard substrate to the flexible circuit board to form a printed circuit board; and a step of forming a protective layer for protecting the printed circuit board. 본 발명은 이종접합 인쇄회로기판의 제조방법이 개시된다. 본 발명의 이종접합 인쇄회로기판의 제조방법은, 경성 기판을 형성하는 단계; 연성 기판에 회로패턴을 형성하여 연성 회로기판을 형성는 단계; 경성 기판과 연성 회로기판을 접합하여 인쇄회로기판을 형성하는 단계; 및 인쇄회로기판을 보호하기 위한 보호층을 형성하는 단계;를 포함하는 것을 특징으로 한다.
Bibliography:Application Number: KR20150130340