PRESSURE SENSITIVE ADHESIVE ASSEMBLY SUITABLE FOR BONDING TO UNEVEN SUBSTRATES

• Main Authors: HEIMINK JAN, HASENBERG DIRK, UNVERHAU KERSTIN, JUNG ADRIAN T, BACKES ANDREAS
• Format: Patent
• Language: English; Korean
• Published: 22.03.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

본 발명은 불균일한 표면을 갖는 기재에 결합하기에 적합한 감압 접착제 (PSA) 조립체에 관한 것으로서, 감압 접착제 (PSA) 조립체는 중합체 베이스 재료를 포함하고, 실험 섹션에 기재된 시험 방법에 따라 120℃에서 측정한 경우, 복합 점도가 2,000 Pa.s 내지 80,000 Pa.s에 포함되는 중합체 폼 층을 포함한다. 본 발명은 또한 불균일한 표면을 갖는 기재에 감압 접착제 조립체를 적용하는 방법 및 이의 용도에 관한 것이다. The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa.s to 80,000 Pa.s, when measured at 120°C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.