EPOXY RESIN-EPOXY CURING SYSTEMS WITH A LATENT THICKENING TENDENCY

• Main Authors: OMEIS JUERGEN, PRITSCHINS WOLFGANG, KOCKOTH SASCHA, PIESTERT FREDERIK
• Format: Patent
• Language: English; Korean
• Published: 28.02.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

본 발명은: i) 적어도 1종의 에폭시 수지, ii) 적어도 1종의 무기 증점제(a1), 및 iii)상기 무기 증점제(a1)의 증점 효과를 억제하는 적어도 1종의 습윤 및 분산제(a2)를 포함하는 적어도 1종의 에폭시 수지 성분 (1); 및 i) 상기 무기 증점제(a1)의 증점 효과의 억제를 적어도 부분적으로 제거시키는 적어도 1종의 성분 (b1)를 포함하는 경화제 성분 (2)를 포함하고, 여기에서, 상기 습윤 및 분산제(a2)는 적어도 1종의 에폭시 수지에 대하여 비반응성인 것이고, 경화제 성분 (2)는 에폭시 수지 성분 (1)에 대하여 반응성인 것인, 이성분 또는 다성분 시스템에 관한 것이다. 본 발명은 또한 본 발명에 따른 상기 이성분 또는 다성분 시스템으로 코팅된 기질에 관한 것이기도 하다. 본 발명은 또한 제제에 잠복성 증점 효과를 부요하기 위한, 에폭시 수지 조성물 중 (a1)과 (a2)의 조합의 용도에 관한 것이기도 하다. The invention relates to a two-component or multi-component system having at least one epoxy resin component (1) that comprises i. at least one epoxy resin, ii. at least one inorganic thickener (a1) and iii. at least one wetting and dispersing agent (a2) that inhibits the thickening effect of said inorganic thickener (a1); as well as a curing component (2) which comprises i.) at least one component (b1) that at least partially cancels the inhibition of the thickening effect of the inorganic thickener (a1); said wetting and dispersing agent (a2) being non-reactive to the at least one epoxy resin, and the curing component (2) being reactive to said epoxy resin component (1). The invention also relates to substrates coated with a two-component or multi-component system according to the invention. The invention also relates to the use of a combination of (a1) and (a2) in epoxy resin compositions, in order to give the formulation a latent thickening effect.