METHOD OF MANUFACTURING A CORE SUBSTRATE HAVING A REINFORCEMENT MATERIAL

• Main Authors: YOON, KWAN SUN, PARK, JONG YOUNG
• Format: Patent
• Language: English; Korean
• Published: 16.02.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention provides a method of manufacturing a substrate core. The method of manufacturing a substrate core comprises the steps of: (a) cutting a plurality of reinforcement materials to a predetermined length at a predetermined position on an adhesive plate; (b) stacking a first insulating layer on the reinforcement materials, and heating and pressurizing the stacked first insulating layer to perform lamination thereon; (b) peeling off the adhesive plate; and (d) stacking a second insulating layer at a position from which the adhesive plate is removed, and heating and pressurizing the stacked second insulating layer to perform lamination thereon. So, the generation of cracks in a substrate can be prevented in a post cutting process. 본 발명은 기판 코어를 제조하는 방법에 있어서, (a) 접착판 위에 선정된 위치에 선정된 길이로 보강재를 절단하여 복수 개 부착하는 단계; (b) 상기 보강재 위에 제1 절연층을 적층하고 가열 가압하여 라미네이션 하는 단계; (c) 상기 접착판을 박리하여 제거하는 단계; 및 (d) 상기 접착판을 제거한 위치에 제2 절연층을 적층하고 가열 가압하여 라미네이션 하는 단계를 포함하는 기판 코어 제조방법을 제공한다.