ETCHING SOLUTION FOR ETCHING MULTILAYER THIN FILM COMPRISING COPPER LAYER AND TITANIUM LAYER ETCHING METHOD USING SAID SOLUTION AND SUBSTRATE OBTAINED BY USING SAID METHOD

• Main Authors: GOTO TOSHIYUKI, YAMADA YOZO, HONMO YOSHIHIRO
• Format: Patent
• Language: English; Korean
• Published: 13.02.2017
• Subjects: ADHESIVES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NATURAL RESINS; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PAINTS; POLISHES

The present invention relates to an etching liquid for etching a multilayer thin film comprising a copper layer substantially made of copper and a titanium layer substantially made of titanium, both of which are laminated on a substrate made using at least one selected among glass, silicon dioxide and silicon nitride. The etching liquid is an aqueous solution which contains: (A) from 4.5 to 7.5% by mass of hydrogen peroxide; (B) from 0.8 to 6% by mass of nitric acid; (C) from 0.2 to 0.5% by mass of a fluoride compound; (D) from 0.14 to 0.3% by mass of an azole; (E) from 0.4 to 10% by mass of an amine compound selected among (E1) an alkyl amine having at least one chain or branched alkyl group which has from 2 to 5 carbon atoms and can be substituted with a methoxy group, (E2) an alkanolamine having from one or two straight chain or branched hydroxyalkyl group having from 2 to 5 carbon atoms, and optionally having one or two straight chain or branched alkyl group having from 2 to 5 carbon atoms, (E3) a diamine having a straight chain or branched alkylene group having from 2 to 5 carbon atoms, and (E4) cyclohexylamine; and (F) from 0.005 to 0.1% by mass of a hydrogen peroxide stabilizer, and has a pH value of from 1.5 to 2.5. [과제] 유리, 이산화규소 및 질화규소로부터 선택되는 1종 이상을 이용한 기판 상에 적층된 구리를 주성분으로 하는 구리층 및 티탄을 주성분으로 하는 티탄층을 포함하는 다층박막을 에칭하기 위한 에칭액, 및 이것을 이용한 구리층 및 티탄층을 포함하는 다층박막의 에칭방법, 그리고 이 에칭방법을 이용하여 얻어지는 기판을 제공한다. [해결수단] (A)과산화수소의 농도가 4.5~7.5질량%, (B)질산의 농도가 0.8~6질량%, (C)불소 화합물의 농도가 0.2~0.5질량%, (D)아졸류의 농도가 0.14~0.3질량%, (E)메톡시기로 치환될 수도 있는 직쇄상 또는 분지상의 탄소수 2~5의 알킬기를 1개 이상 갖는 알킬아민(E1); 직쇄상 또는 분지상의 탄소수 2~5의 하이드록시알킬기를 1개 또는 2개 갖고, 또한, 임의로 직쇄상 또는 분지상의 탄소수 2~5의 알킬기를 1개 또는 2개 갖는 알칸올아민(E2); 직쇄상 또는 분지상의 탄소수 2~5의 알킬렌기를 갖는 디아민(E3); 및 시클로헥실아민(E4)으로부터 선택되는 1종 이상인 아민 화합물의 농도가 0.4~10질량%, 및 (F)과산화수소 안정제의 농도가 0.005~0.1질량%를 포함하는 수용액이며, 또한, pH값이 1.5~2.5인 에칭액.