A PROCESS AND APPARATUS FOR DETACHING A DISPLAY MODULE BONDED BY A LIQUID OPTICALLY CLEAR ADHESIVE

• Main Authors: BILCAI EUGEN, DUFRESNE STEVEN
• Format: Patent
• Language: English; Korean
• Published: 08.02.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

본 발명은 전자 어셈블리로부터 컴포넌트를 탈착시키기 위한 프로세스에 관한 것이다. 특히, 본 발명은 전자기 방사 (EMR) 를 이용함으로써 디스플레이 모듈에서 액체 광학 투명 접착제 (LOCA) 로 본딩된 컴포넌트를 탈착시키기 위한 프로세스에 관한 것이다. The present invention relates to a process for detaching a component from an electronic assembly. In particular, the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).