ACOUSTIC WAVE DEVICE AND MODULE
The purpose of the present invention is to provide an acoustic wave device capable of being miniaturized. The present invention relates to an elastic device, comprising: a supporting substrate (10); a piezoelectric substrate (12) which is bonded to the upper surface of the supporting substrate at ro...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
08.02.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The purpose of the present invention is to provide an acoustic wave device capable of being miniaturized. The present invention relates to an elastic device, comprising: a supporting substrate (10); a piezoelectric substrate (12) which is bonded to the upper surface of the supporting substrate at room temperature and includes material different from that of the supporting substrate (10); a comb-shaped electrode which is formed on the upper surface of the piezoelectric substrate (12) and excites an elastic wave; and an amorphous layer (14) which is formed between the supporting substrate (10) and the piezoelectric substrate (12).
소형화가 가능한 탄성파 디바이스를 제공하는 것을 과제로 한다. 본 발명은 지지 기판(10)과, 상기 지지 기판(10)의 상면에 상온 접합되고, 상기 지지 기판(10)과 상이한 재료를 포함하는 압전 기판(12)과, 상기 압전 기판(12)의 상면에 형성되고, 탄성파를 여진하는 빗살형 전극과, 상기 지지 기판(10)과 상기 압전 기판(12) 사이에 형성된 아몰퍼스층(14)을 구비하는 탄성파 디바이스이다. |
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Bibliography: | Application Number: KR20160094674 |