Cleaning apparatus for wire clamp and cleaning system including the cleaning apparatus

According to an embodiment of a technical idea of the present invention to solve a problem, a cleaning apparatus comprises: a body unit; a tip unit connected to one end of the body unit, and including a support unit extended in a direction away from the body unit; a polishing member having a first s...

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Bibliographic Details
Main Author LIM, JUN SUK
Format Patent
LanguageEnglish
Korean
Published 08.02.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to an embodiment of a technical idea of the present invention to solve a problem, a cleaning apparatus comprises: a body unit; a tip unit connected to one end of the body unit, and including a support unit extended in a direction away from the body unit; a polishing member having a first surface with a polishing surface, and a second surface opposite to the first surface; and a fixation unit tightly attaching the polishing member to the support unit, and fixating the polishing member to enable the polishing surface to be in contact with a cleaning target surface. 상술한 과제를 해결하기 위하여 본 발명의 기술적 사상의 일 실시예에 의한 클리닝 장치는 몸체부, 상기 몸체부의 일단과 연결되며, 상기 몸체부로부터 멀어지는 방향으로 연장하는 지지부를 포함하는 팁부, 연마면을 갖는 제1 면 및 상기 제1 면과 반대되는 제2 면을 가지는 연마 부재, 및 상기 연마면이 클리닝 대상면에 접촉 가능하도록 상기 연마 부재를 상기 지지부에 밀착시켜 고정시키는 고정부를 포함하는 것을 특징으로 한다.
Bibliography:Application Number: KR20150108867